News Update

MIETY Expands SemiconIndia futureDESIGN DLI Scheme, Welcomes Two More MSMEs

• ByStartupStory     |    July 31, 2023

The Ministry of Electronics and IT (MIETY) has recently extended its SemiconIndia futureDESIGN Design Linked Incentive (DLI) scheme by including two more promising semiconductor design startups and MSMEs—Aheesa Digital Innovations and Calligo Technologies. The announcement was made during the prestigious SemiconIndia 2023 conference held in Gandhinagar on July 29th. The DLI scheme offers vital financial incentives and design infrastructure support to companies at various stages of semiconductor design, including Integrated Circuits, Chipsets, SoCs, Systems and IP cores, and semiconductor-linked designs.

Chennai-based Aheesa Digital Innovations, specializing in telecom, networking, and cybersecurity, is set to embark on the development of the Aheesa Vihaan series of networking SoCs (Systems on Chips) as part of the scheme. These indigenous SoCs will feature the innovative VEGA Processor Core developed by the Center for Development and Advanced Computing.

Calligo Technologies, headquartered in Bengaluru, is a prominent player in high-performance computing (HPC), big data, artificial intelligence, and machine learning. Under the DLI scheme, Calligo Technologies will focus on the creation of an accelerator product utilizing the revolutionary POSITs number system. This product will be seamlessly integrated into Digital India’s RISC-V Processor (DIR-V), further advancing India’s technology prowess.

Earlier this year, MIETY had announced the names of five other startups/MSMEs during the DLI Roadshows held in Bengaluru and Delhi. With the recent addition of Aheesa Digital Innovations and Calligo Technologies, the total number of beneficiaries under the DLI scheme now stands at seven.

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